Double sided MCPCB (the two copper layers were put on the each side of metal core respectively), and you can only populate SMD on top side.
Different from Single layer MCPCB, 2 layers MCPCB requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together.
Compared with normal FR4, this structure need more technology and experience on laminating of two layers together with metal core.
The processing steps of the MCPCB with the metal base embedded in the PCB are comparatively complex as hole plugging is required after primary drilling on the metal base in order to isolate it from the circuitry.
Capability of 2L MCPCB
•Base material: Aluminum/Copper/Iron Alloy
•Thermal Conductivity (dielectrial layer): 1.0, 1.5, 2.0, 3.0 W/m.K.
•Board Thickness: 0.5mm~3.0mm(0.02"~0.12")
•Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
•Solder mask: White/Black/Blue/Green/Red/yellow
•Legend/Silkscreen Color: Black/White
•Surface finishing: Immersion Gold, HASL, OSP, immersion silver, ENEPIG
Baggio WANG FAN
SHENZHEN JAAPSON TECHNOLOGY CO LTD
skype: baggiowang0214
JAAPSON, Expert in HDI Multi-layer PCB Manufacturing
